Electronic parts fixation, circuit board bonding, glass, lighting, building materials industries, etc.
Encapsulant and Potting silicone
Applications of Encapsulant and Potting silicone:
Encapsulant and Potting silicone is applicable to sealing, bonding and coating for electronic parts. Filling for LED, LCD electronic display, circuit board.
Description of Encapsulant and Potting silicone:
HY-210# Encapsulant and Potting silicone is two-component room temperature vulcanization silicone rubber, which has low viscosity, easy mixing and pouring, is applicable to bulk pouring with excellent electrical performance.
Standard Datasheet of Encapsulant and Potting silicone:
Model HY-210# Encapsulant and Potting silicone Type
Gel-type Components A B
Appearance (liquid) black / transparent / white yellowy
Mixing ratio 100 5
Viscosity (Pa.s) 5000
Pot life(25C) (mins) 20 - 30
Curing time (mins) 2 - 4
Hardness shore A 25 ± 2
Tensile strength (Mpa) 0.5 - 1.5
Elongation at break (%) 30 - 50
Dielectric strength (kv/m-1) 20
Specific inductive capacity(1MHz) 2.8 - 3.2
Breakdown voltage (KV.mm-1) 16
Volume resistivity () 1×1014
Dielectric loss factor (1MHz) 1×10-3
Features of Encapsulant and Potting silicone:
HY-210# Encapsulant and Potting silicone has sticky viscosity, low shrinkage and non-corrosive;
the HY-210# Encapsulant and Potting silicone can be used for a long period at the temperature of -60C-200C with the characteristics of moisture-proof and waterproof, radiation-proof as well as weatherable and anti-ageing.
Using Instructions of Encapsulant and Potting silicone:
1. Clean and dry the electronic element to be poured;
2. Mix the component A (silicone) and component B(hardener) evenly according to the proportion, and can be poured after deaired the bubbles. The surface will cure in about 2-4 hours after pouring.
More information need about our HY-868# silicone sealant, please feel free to contact with Miss Apple.
Tel: 0086-755-89948013
Moible: 0086-15889446131
silicone foe Electronic parts, glass
