Low Melt Polyamide Resin Hot Melt Adhesive: Excellent adhesion laundry&dry cleaning resistance solvent resistance
Low Melt Polyamide Resin Hot Melt Adhesive Technical Data Sheet
update: 2012.03.23
Reference Product properties | HT-8115 | |
Appearance Form | Granule | |
Components | COPA(Copolyamide) | |
Optical Brightener Additives | Yes | |
Melting range DSC (°C) | 90-100 | |
Melt-index (g/10min) (160°C/21.18N) | 25-35 | |
Density (g/cm3) | 1.1 | |
Specifications | Granule | Φ(3-4)×(5-6)mm |
Bonding condition (for reference only) | Temperature (°C) | 110-130 |
Press (kg/cm2) | 1.5-2.0 | |
Time (S) | 10-15 | |
Laundry resistance | 40°C | excellent |
60°C | satisfactory | |
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Dry-cleaning resistance | excellent | |
The characteristic and application of COPA granule:
The melting range is within a small range, good adhesion, excellent laundry resistance, solvent resistance and instant solidifying etc. The appearance of the granule is near clear and well-proportioned. It is user - friendly and convenient.
Application fields: garment, reflective materials, automotive and leather industries.
Factory:
R&D:
Deep cold pulverization:
Certification:
Exhibition:
Low Melt Polyamide Resin Hot Melt Adhesive
