strong grinding ability,high intensity,abrasion-resistance and purity,with good dispersion and wear resistance.
Description: Raw material is adopted from high technology and high-intensity MBD series of high quality diamond,with special processing, more regular crystal shape, more concentrated particle size distribution and effective grinding particle, strong grinding ability, high intensity, abrasion-resistance and purity, with good dispersion and wear resistance.Usage: Applied in cutting,grinding and polishing of Organic and inorganic brittle materials, such as wire saw, Gem and Semiconductor blade; also used in High-tech material coarse grinding, fine grinding and polishing of Polysilicon, Gem, Sapphire, Quartz, Optical instruments, LED sapphire substrates, LCD glass and so on.
diamond powder specially used for diamond wire
