1.Solar and semiconductor wafer wire sawing 2.High-grade SiC lump supplied by our own smelting plant 3.High purity SiC 99.02%
Main features:
Crystal structure, high hardness and strong cutting ability, stable chemical characteristics, good thermal conductivity.
Main applications:
Solar adn semiconductor wafer wire sawing; crystal and ferrite polishing; ceramic and special steel precision polishing; bonded and coated abrasive tools; cutting and polishing; non-ferrous metal lapping such as glass, stone, agate and high-grade jewelry; high-grade refractory materials, engineering ceramic; heating elements and thermal elements.
Detaied specifications:
| F.C% | 0.04 |
| SiC% | 99.02 |
| Fe2O3% | 0.14 |
| D3 | 14.54~14.64 |
| D50 | 10.23~10.25 |
| D94 | 6.82~6.96 |
| Bulk Density(g/cm3) | 1.65 |
| PH | 7.31~7.52 |
for solar wafering silicon carbide powder
