Detailed Product Description
XAN-SI-1001 slurry for first polishing of silicon wafers
XAN-SI-1001 slurry employ the colloidal silica with large size as the abrasive, therefore, it is fit for the fast removal of silicon in the first polishing process.
Main polishing condition: Batch polishing type machine, SUBA600 pad
Main polishing performance: removal rate: > 1000 nm/min
TTV: <5mm
XAN-SI-1201 slurry for secondary polishing of silicon wafers
XAN-SI-1201 slurry employs high purity colloidal silica with uniform size distribution as the abrasive and some special alkali and surfactant as the chemical components. Good silicon surface quality can be obtained after the secondary polishing process.
Main polishing condition: Batch polishing type machine, SUBA800 pad
Main polishing performance: removal rate: >800nm/min
TTV: <2mm
RMS5mm´5mm1-2Å
Wafer surface metal ions content<1010cm-2
