Silicon Carbide High purity Grains are isometric with sharp edge Particle size distribution is narrow large specific
Applications
For cutting and grinding monocrystalline silicon,polysilicon,gallium arsenide and quartz crystal in the solar cells,semiconductors and piezo quartz industry.
Quality Standard
Particle Size:JIS R6001-1998(by Beckman Coulter MultisizerTm3)Composition:GB/T3045-2003(by chemical analysis method).Special inspection based on customers' need.
Features
1.High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition.2.Grains are isometric with sharp edge, which ensure the even self-sharpening capability as cutting material and minimum TTV of the products been cut.3.Particle size distribution is narrow and even under load guarantee the small wire expansion in processing, suitable to all kinds of wire saw machine.4.Micropowder has large specific and cleanness surface after specially treated, and easily fit cutting fluid, such as polyethyleneglycol.
Parameter
Silicon Carbide Micropowder for Multi-wire Cutting & Grinding
