... cutting machine suit cutting,drilling,engraving PCD,PCBN,CVD,diamond,tungsten carbide,cearmics and slilicon wafer LCP-30 laser cutting machineMain technical parameters(1 ... properties. Introduction for LCP 30: Machine TypePowerDepth of CutKerf WidthSpeed Recommended in cutting 1mm thick PCDApplicationsRemarksSolid PCD InsertsPCD and ... or CCD Picture Pick-up SystemCooling System Laser Cutting Machine