Detailed Product Description SILICON WAFER GRINDING WHEELSize: 4",6",8",12"SEGMENT: continous, segmented Vitrified ... achieve stable grinding process, even for wafers tat are layered with oxide or nitride.Resin bond: fine grinding, little damage for ... workpieces, provide stable grinding .Application: Silicon and compound semiconductor wafer, etcFeatures:1.Long life.2. Require less wheel dressing .3 ...