- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing, Wafer protection*UV curing type*Expandable type*Precented dicing wafer from penetrating into interface*Improved back side chipping*Improved back side contamination by wafer*Adhesive strength depends on chip size, chip thickness,etcSpecification:Tape Color: WhiteTape Thickness: ...