1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before ... - Improved back side chipping, contamination by water Feature:*Wafer dicing, Wafer protection*UV curing type*Expandable type*Precented dicing ... Improved back side contamination by wafer*Adhesive strength depends on chip size, chip thickness,etcSpecification:Tape Color: ColorTape Thickness: 130umBase ...