Detailed Product Description SILICON WAFER GRINDING WHEELSize: 4",6",8",12"SEGMENT: continous, segmented Vitrified ... grit diamond are employed to achieve stable grinding process, even for wafers tat are layered with oxide or nitride.Resin bond ... : fine grinding, little damage for workpieces, provide stable grinding .Application: Silicon and compound semiconductor wafer, etcFeatures:1.Long life.2. ...