Detailed Product Description ULTRA-THIN DIAMOND BLADE WITH HUBMetal bondResin bond.thickness0.01-0.015mm.Application: Silicon, Semiconductor,such as GaAs, GaP, etc.Features:1. High grit concentration allows for extremely stable lifetime, reduce the size of backside chipping2. Higer blade strength reduces wavy cutting and blade breakage3. Shorter precut times and lower chance of blade breakage due ...