Detailed Product Description Model: BK 250g BGA PasteWelding materials used.Solder paste, metal powder.Sn: 63%Ag: 8%Cu: 10%Flux: 19%Volume: 250g~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~Phone chip repair, computer or home appliance repair path chip BGA-specific products.Joints full and bright, no cold solder joint, false welding phenomenon.