pcb(2013) Buried and blind via structure: L1-L2; L2-L3, L5-L6, L8-L10 Surface processing; Immersion gold Green soldermark pcb(2013)Buried and blind via structure: L1-L2; L2-L3, L5-L6, L8-L10Surface processing; Immersion goldGreen soldermarkOur PCB capability:Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.Maximum Panel Size: 26" X 26" (660mm X 660mm)Line Width & ...
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