Detailed Product Description Features: 1) Surface finish: hot air solder leveling, entice, immersion gold, carbon ink, gold finger, peelable mask 2) Solder mask: photo imageable 3) Profile: routing, punching, V-Cut, chamfered 4) Number of layers for mass production: 2 – 6 5) Min. hole diameter: 0.2mm 6) Max. panel size: 18' x 24' 7) Board thickness: 0.4 - 2.4mm