Detailed Product Description PCB assembly,PCBA,SMT,DIP process.Technical requirement:1) Surface-mounting Technology(SMT) and Through-hole/DIP2) 0201,0402,0603 size components SMT technology and lead free technology3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.4) UL,CE,FCC,Rohs standard5) With IPC-610D manufacturing and other international standards.6) Nitrogen gas reflow ...
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